Thin graphite coating using Sputter

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  Sputtering deposition of graphite thin film on metal foil without adhesive

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  Free from reduction of Heat spreading effect by adhesive

• 3

  Advanced composite material with integrated Heat Sink and EMI protection

• 4

  Rapid Horizontal heat diffusion by deposited Graphite Layer

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  Rapid Vertical heat diffusion and increased heat capacity by metal layer

• 6

  High density graphite layer → Dust free and excellent wear resistance

• 7

  Patent registration

Thin graphite layer using Sputter deposition

Sortation	Natural graphite	Artificial graphite	GENECOAT
Structure
Pros and cons	Good price competitiveness poor thermal conductivity → 150 ~ 200 W/m.k (H) → ~ 10 W/m.k (V)	Good thermal conductivity → 600 ~ 700 W/m.k (H) → ~ 10 W/m.k (V) Dust generation Limit thickness of product A lot of production processes. Dust generation	Good thermal conductivity → 450 ~ 600 W/m.k (H) → ~ 40 W/m.k (V) Particle free Available in a variety of thicknesses A competitive price High initial equipment investment costs
Heat diffusion
Product photo

Wet coating using Comma & Gravure

• 1

  Organic binder design technology and heat dissipation powder design technology

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  Nano particle powder design technology

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  Organic binder bonding technology

• 4

  Realize high thermal conductivity products by combining graphene, CNT, metal powder, ceramic powder, etc

PCM (Phase Change Material)

Silicon/Acrylic TIM (Thermal Interface Material)