Laser cutting system
Proprietary Optical System & Tech Support
Robot System for Breaking & Unloading
30um ~ 100um UTG Cutting
Glass Chipping < 3um
Chemical cutting system
Chemical etching System & Tech Support
Both side spray or dipping type
30um ~ 100um UTG Cutting
No glass chipping
Cleaning system
Improving cleaning quality by shaking baskets(40㎜ up/down)
Water mark protection by Final Hot DI water & EQL(Edge Quick Life-up)
Anti-vibration by Chuck & Grip
Chemical strengthening system
Maintain Temperature of CS Bath
Anti-Vibration System
Improve Temperature uniformity of CS Bath
Edge chamfer system
Remove fine clack and chipping from edge after UTG cutting
Machining the shape of the Cell cross section with a chamfer
No need for fine cell stacking
Soft etching(Healing) system
Remove fine clack and chipping from Cell surface & edge after UTG cutting
Improve nature of Cell surface & edge after CS process
Rapid processing
